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Instruction Manual

Appendix BX Rev. 1.2

January 1997

Rosemount Analytical Inc. A Division of Emerson Process Management Appendices B-1

World Class 3000

APPENDIX BX, REV. 1.2

HPS 3000 HEATER POWER SUPPLY FIELD MODULE

(CENELEC APPROVED VERSION)

DESCRIPTION

Consult Safety Data Sheet 1M03243 for

safety related information.

B-1 DESCRIPTION

The Rosemount CENELEC approved HPS 3000

Heater Power Supply Field Module (Figure B-1)

acts as an interface between probe and elec-

tronics and supplies power to the probe heater.

The unit allows the use of probes with a number

of different electronics packages.

The CENELEC approved HPS 3000 is certified

EExd IIC T6 to CENELEC standards EN50014

and EN50018.

The heater power supply, Figure B-2, consists

of a motherboard, daughterboard, and a trans-

former for supplying correct voltage to the

probe heater. The mother- and daughter-

boards contain terminal strips for connecting

probe, electronics, and power supply.

The HPS is jumper configurable for 120, 220, or

240 Vac.

If you reconfigure the equipment for a

line voltage other than the one marked

on the serial label, then you should

change the marking on the serial label

to state the new line voltage.

P00001B

Figure B-1. CENELEC Approved HPS 3000

Heater Power Supply Field Module

B-2 THEORY OF OPERATION

The HPS 3000 Heater Power Supply may per-

form slightly different functions, depending upon

which electronics package with which it is used.

Figure B-3 shows a functional block diagram of

the unit. The HPS contains a transformer for

converting line voltage to 44 volts needed to

power the probe heater. The relay can be used

to remotely turn the probe on or off manually.

A triac module is used to turn the heater on or

off, depending on probe temperature.

When used with the CRE 3000 Control Room

Electronics or IFT 3000 Intelligent Field Trans-

mitter, the HPS uses a cold junction tempera-

ture compensation feature. This allows for the

use of a less expensive cable between the HPS

and CRE or HPS and IFT. The HPS and elec-

tronics package can be located up to 364 m

(1200 ft) apart.

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